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  1. MediaTek introduced in China an improved version of its flagship processor Dimensity 1000 5G. The company focused on increasing the performance of the chipset by introducing new technologies and supporting modern functions. During the presentation of Dimensity 1000+, the manufacturer did not go into technical details. One of the main differences in comparison with the usual Dimensity 1000 was the support for screens with a refresh rate of 144 Hz instead of 90 Hz. The new chip is equipped with a built-in 5g modem with carrier aggregation and MediaTek 5G UltraSave technology, which dynamically adjusts the power and operating frequency of the modem according to network conditions and user actions for significant energy savings. Another innovation is the support for HyperEngine 2.0 technology, which serves to improve the gameplay by optimizing the use of system resources. However, MediaTek focused on the visual component with its proprietary MiraVision technology. It allows you to adjust the contrast, sharpness, and color rendering of the frame in real-time to improve the quality of the output image. In addition, the MiraVision Picture Quality Engine offers more accurate image calibration and a wide dynamic range compared to HDR10+. Finally, MiraVision improves regular SDR videos to HDR quality. In the near future, MediaTek promises the appearance of devices based on the Dimensity 1000+. The first new processor will receive an unannounced smartphone from iQOO, a sub-brand of Vivo.
  2. The streaming video market is expected to reach $124.57 billion by 2025. One of the expansion drivers will be fifth-generation networks. In this regard, MediaTek was the first in the industry to implement the advanced AV1 hardware video decoder in its Dimensity 1000 5G processor for viewing high-resolution videos with less traffic consumption. AV1 is now considered one of the most promising video codecs. According to MediaTek, it provides more efficient data compression, giving users higher image quality. In addition, it allows you to play videos more smoothly while consuming less Internet traffic. The AV1 video codec does not require any license fees. It was created to replace the outdated VP9 and has already become one of the standards for playing videos from the Internet. AV1 provides 30% higher compression efficiency compared to VP9. The MediaTek initiative has already been appreciated by Google representatives, who believe that this AV1 format will become an important component of portable devices, allowing them to play high-resolution video.
  3. At the beginning of each month, Google publishes a report on Android device vulnerabilities discovered by the search giant itself or other companies. The new document was an unpleasant surprise for owners of devices with MediaTek chips, millions of which were exposed to a dangerous vulnerability that allows you to easily "open" the protection of the gadget. The CVE-2020-0069 rootkit, called MediaTek-su, allows you to get root access and "open" the SELinux core for any application installed on the device, successfully bypassing the standard Android restrictions. The vulnerability was first discovered on the Amazon Kindle Fire tablet, but later it turned out that the script also works on many other gadgets. According to the authors of the study, the list of vulnerable chips contains “almost all” 64-bit MediaTek processors, including MT6735, MT6737, MT6738, MT6739, MT6750, MT6753, MT6755, MT6757, MT6758, MT6761, MT6762, MT6763, MT6765, MT6771, MT6779, MT6795, MT6797, MT6799, MT8163, MT8167, MT8173, MT8176, MT8183, MT6580 and MT6595. According to XDA-Developers, the exploit allows an attacker to completely take control of a victim’s smartphone - install new applications, change permissions for existing ones and gain access to personal data. Although after rebooting, the script’s access to the root system is reset, a malicious application may restart it every time the gadget is turned on. MediaTek has already released a software patch to prevent exploitation of the vulnerability, but the pace of its distribution depends on OEM manufacturers. They should include the “patch” in updates of proprietary firmware. The company also turned to Google for help - it is reported that from March of this year, the patch will be included in monthly Android security updates. At the same time, owners of old gadgets whose firmware is no longer officially updated are still at risk.
  4. MediaTek has launched the new Helio P95 chipset for mid-range smartphones. The features of the new items are the accelerator of artificial intelligence APU 2.0, which increases the speed of gadgets in various scenarios, support for cameras with a resolution of up to 64 megapixels and proprietary gaming technology HyperEngine. The eight-core MediaTek Helio P95 processor as part of the mobile platform is represented by two Cortex-A75 cores (2.2 GHz) and six Cortex-A55 (2.0 GHz) cores. The PowerVR GM 9446 graphics accelerator, according to the manufacturer, provides a 10% increase in SoC performance compared to the Helio P90. The chipset supports up to 8 GB of RAM LPDDR4X with a frequency of 1866 MHz and drives standard UFS 2.1. Manufacturers of smartphones based on Helio P95 can use displays with a resolution of up to 2520x1080 pixels and an aspect ratio of 21: 9, as well as cameras with 64 MP sensors or dual modules (24 + 16 MP). The image processor supports the processing of 14-bit RAW and 10-bit YUV images. For obtaining high-quality photographs in poor lighting conditions, recognition in a frame of up to 5 people at the same time and accurate determination of the depth of images is answered by the neural computing unit. The company positions the proprietary engine APU 2.0 as “one of the most powerful AI-based solutions for smartphones with support for 4G LTE”. MediaTek HyperEngine technology is designed to optimize system resources when launching games. The list of wireless interfaces supported by the chipset includes Wi-Fi 5 and Bluetooth 5.0 standards. The start date for deliveries of the new mobile platform and the list of smartphones that will be the first to receive the new processor are not reported by the chipmaker.
  5. MediaTek has released the Helio G80 mobile platform for mid-range gaming smartphones. One of the main features of the new product is support for HyperEngine technology, designed to speed up the processing of game scenarios. The new chipset Helio G80 is based on 12-nm process technology, received two ARM Cortex-A75 processor cores with a maximum clock speed of up to 2 GHz and six Cortex-A55 (1.7 GHz). The GPU Mali-G52 2EEMC2 with a video core frequency of up to 950 MHz is responsible for the graphics capabilities of the platform. Proprietary HyperEngine technology uses a switching mechanism between Wi-Fi and LTE for 13 milliseconds to eliminate disconnects in online games. A special algorithm also provides smart control of the processor, GPU, and memory, optimizing the gameplay in demanding applications and reducing the battery consumption of the smartphone. The list of wireless interfaces supported by the chipset includes Wi-Fi 8092.11 ac (2.4 GHz + 5 GHz), Bluetooth 5.0, GPS, GLONASS, Beidou and Galileo, as well as LTE Cat. thirteen. The mobile platform supports working with RAM LPDDR3-933 (up to 4 GB) and LPDDR4X-1800 (up to 8 GB), as well as eMMC 5.1 drives. Multimedia features include support for camera sensors up to 48 megapixels, a face-unlock feature for front-facing modules, bokeh effects, electronic image stabilization by the Hardware Warping Engine, and 4K @30 fps video decoding (H.264, H.265, HEVC). The debut of the first smartphones based on the new mobile platform is expected this month.
  6. Following the flagship mobile platform, MediaTek introduced a new solution for mid-range smartphones called Dimensity 800. Immediately after the announcement, the company declassified all the key features of the new chip and announced the launch dates for the first smartphones based on it. Dimensity 800 will take the second place in the hierarchy of the most powerful processors of the company, losing the lead to the flagship Dimensity 1000 5G announced in mid-December. The new chip is equipped with four Cortex-A77 productive cores operating at a frequency of 2.6 GHz and four energy-saving Cortex-A55 (2.2 GHz). The GPU Mali-G77 MP9 is responsible for the graphics capabilities of the chip, which is identical in performance to its counterpart in the Exynos 990 chipset but has two fewer cores. A 5G Helio M70 5G modem is integrated into the Dimensity 800 processor, with a potential bandwidth of 4.7 Gb / s and support for autonomous (SA) and non-autonomous networks (NSA). The first smartphones with the Dimensity 800 chip are expected to go on sale in the second quarter of 2020. The flagship Dimensity 1000L 5G will debut earlier - OPPO Reno3 will be built on its basis, the presentation of which will take place in the near future.
  7. Historically, MediaTek processors were noticeably inferior to analogs from Qualcomm and other manufacturers. At one point, the Chinese company even stopped producing flagship chips, focusing on the middle class. But with the release of the new MediaTek Dimensity 1000 5G, everything should change dramatically. This is confirmed by the first results of testing the chipset. The new MediaTek Dimensity 1000 5G scored an impressive 511,363 points in the AnTuTu benchmark (v8.1.4). This is more than any Android smartphone. The closest competitors are gaining about 480,000 "parrots." Interestingly, even the Mali-G77 graphics accelerator showed a high result of 196 097 points - comparable to the Adreno 640 in the Snapdragon 855 Plus. Note that after the presentation of MediaTek Dimensity 1000, the head of the Redmi brand Lu Weibing congratulated MediaTek on the new product and confirmed that this chipset will be used in their smartphone, which will be released in 2020. It is assumed that we are talking about the future of Redmi K30 Pro 5G. The usual Redmi K30 will officially be presented next month.
  8. MediaTek announced the Dimensity line of mobile platforms for smartphones that support fifth-generation mobile networks. A single-chip system (SoC) called Dimensity 1000 will be an alternative to Qualcomm Snapdragon flagship chipsets. In addition to the productive ARM processor cores, the gadget is notable for the simultaneous use of two 5G SIM cards and an impressive set of other wireless interfaces. The mobile platform manufactured using the 7-nm process technology is based on four ARM Cortex-A77 cores with a clock frequency of 2.6 GHz and four Cortex-A55 (2.0 GHz) with the support of the Mali-G77 graphics accelerator. The single-chip system (SoC) includes the AI Processing Unit AI module (APU 3.0) with a speed of about 4.5 trillion operations per second. The built-in 5g modem, according to the manufacturer, supports operation in autonomous and non-autonomous modes (SA/NSA) and provides data download speeds of up to 4.7 Gbit/s (up to — 2.5 Gbit/s) in the frequency range up to 6 GHz. The novelty also supports wireless interfaces Wi-Fi 6 (801.11 ax) and Bluetooth 5.1. Another feature of the novelty was the Dual 5G SIM mode. According to the published specifications, the chipset supports up to 16 GB of LPDD4X RAM and displays with a resolution of up to 2520 x 1080 pixels and a refresh rate of up to 90 Hz. The built-in image processor is responsible for image processing, which is able to "pull" one 80-megapixel camera sensor or a bunch of sensors at 32 and 16 MP. Announced support for hardware decoding 4K video with a frame rate of 60 fps. Specifications: CPU: 4 x Cortex-A77 (2.6 GHz) + 4 x Cortex-A55 (2.0 GHz) Modem: 5G SA / NSA (up to 6 GHz) + 4G TDD / FDD, 4x4 MIMO, 256 QAM, WCDMA, TD-SCDMA, CDMA 1X, EV-DO, GSM / EDGE Communication: 5G + 5G, 4G + 5G, 5G + 4G Wireless interfaces: Wi-Fi 6 (2x2 801.11ax), Bluetooth 5.1, GPS (L1 + L5), GLONASS, Beidou, Galileo RAM Support: Up to 16GB LPDD4X Display support: maximum resolution QHD +, refresh rate up to 90 Hz, HDR Video Processing: 4K (60 fps), Support H.264, H.265, VP9, AV1, Photo processing: 5-core processor, up to 80 megapixels or 32 megapixels + 16 megapixels APU: 3rd Generation 5-core The appearance on the market of the first smartphones equipped with a new chip is expected in the first quarter of 2020.
  9. At the beginning of this year, Intel announced the cessation of the development of its own 5G-modems for smartphones and other mobile devices. Now, the well-known chip maker made a completely unexpected statement about the partnership with the Chinese manufacturer of mobile processors MediaTek. As part of the collaboration, Intel will assist MediaTek in the development, certification, and support of 5G modems for next-generation personal computers. The Chinese company will be engaged in production, while Intel will determine the specifications for 5G solutions, will provide optimization and organize support for cooperation with OEM partners. The companies expect to see the first results of their joint activities at the beginning of 2021. They are already collaborating with Fibocom to produce M.2 5G modules (typically used for solid state drives) designed specifically for devices based on Intel solutions. It has already been announced that HP and Dell are among the first to launch 5G laptops based on solutions from MediaTek and Intel. Earlier this year MediaTek announced its own mobile processor with an integrated Helio M70 5G modem. Its full presentation will take place tomorrow, November 26th.
  10. The network has the test results in the benchmarks of the new chip Helio G90 from MediaTek. The chipset supports HyperEngine technology that optimizes the operation of all smartphone systems to ensure the most comfortable gameplay. Judging by the performance tests, the new product a powerful competitor from Qualcomm. In the single-core test, Geekbench Helio G90 scores 2410 points, while in multi-core mode it gives 7193 points. For comparison, Qualcomm's mid-range Snapdragon 730 gaming chipset, installed in Xiaomi Mi 9T and Samsung Galaxy A80, scores 2493 and 6413 points respectively. It is important to note that the results of the Helio G90 test in Geekbench date back to April this year, so that by the time the first devices are released, its performance may increase due to optimization. In addition, MediaTek introduced a more powerful version of the Helio G90T.
  11. Chinese chip maker MediaTek has introduced a mobile platform Helio G90 and G90T developed especially for games smartphones. In addition to the support of proprietary gaming technology HyperEngine new items are notable for support of the latest 64-megapixel camera modules and increased RAM. Both platforms are manufactured by 12-nanometer process technology and are equipped with eight cores, divided into two clusters: 2 x ARM Cortex-A76 and 6 x Cortex-A55. The maximum frequency of Cortex-A76 in G90 processor is 2.0 GHz, G90T is overclocked to 2.05 GHz. For the graphics capabilities of both new products with support for HDR10 meets video accelerator Mali-G76 3EEMC4 and the difference in clock speed: 720 MHz against 800 MHz in the older modification. The maximum amount of RAM standard LPDDR4X, which support chips is 10 GB. Support for Google Assistant and Alexa assistants is implemented, there is a built-in LTE modem, dual-band Wi-Fi adapter, as well as the declared operation of dual cameras with a resolution of 16 and 24 MP, or a single 64 MP module. Navigation features include support for GPS, GLONASS, Beidou, and Galileo. In the test AnTuTu, Helio G90 scored 222 282 points. In addition, a set of proprietary HyperEngine technologies is designed to increase the performance in games. The price of the new platforms and the release dates of the first commercial devices based on them will be announced later.
  12. MediaTek has announced the release of the advanced MTK i700 chipset for smart home systems. According to the vendor, the performance of the new product allows you to use the new platform even as a replacement for mobile processors for current smartphone models. MediaTek i700 is equipped with two cores Cortex-A75 with a maximum clock speed of 2.2 GHz, six Cortex-A55 (2.0 GHz) and graphics processor IMG PowerVR GM 9446, operating at a frequency of 970 MHz. The chipset supports up to 8GB of lpddr4x-1866 RAM. The built-in block of neural calculations provides a fivefold increase in the speed of face recognition compared to the previous model MTK i500. The new product is able to work with one 32-megapixel camera or module with two sensors on 24 and 16 MP. In the latter case, the processor is able to determine the depth of the image space and calculate the distance to the object in the frame. The maximum video recording rate is 120 frames per second. The MTK i700 is designed to work as part of a smart home, including cameras, security systems and displays. It is expected that the new product will be used for face recognition and AR-functions of smart devices. At the same time the performance of the chipset, as stated by the manufacturer, allows you to use it as a mobile platform in the production of smartphones. Commercial deliveries MediaTek i700 will begin in 2020, the price of new items will be announced later.
  13. The company MediaTek has introduced a new mobile chip, the Helio P65. Like the top Helio P90, it is made by a 12-nm process. According to the manufacturer, in comparison with its predecessor, the new product received a 25 percent increase in power. When developing this model, the main emphasis was placed on gamers to provide them with a comfortable gameplay. MediaTek Helio P65 includes two high-performance Cortex-A75 cores running at frequencies up to 2.0 GHz, and six energy-efficient Cortex-A55 cores running at frequencies up to 1.5 GHz. The graphics subsystem is the arm Mali-G52 video accelerator with a frequency of 820 MHz. It supports screens with resolutions up to 2520x1080 pixels and hardware decoding of 2K video at 30 fps using H. 265 (HEVC) and VP9. MediaTek's proprietary CorePilot technology performs intelligent task management, temperature management, and monitors user habits to continuously maintain maximum performance. The chipset supports the function of voice awakening of the device. MediaTek also shared audio channels for voice control, phone calls, multimedia and games. The processor is compatible with cameras with a resolution of up to 48 MP and dual cameras with a resolution of 16 MP each. Claimed to support a variety of hardware accelerators: depth of field analysis for bokeh photography; electronic image stabilization (EIS); mobile shutter compensation (RSC) technology for shooting at up to 240 frames per second; compensation of jelly effect when recording video; auto exposure when there is a lack of lighting. Among other features of the chipset it is worth noting the support of Dual 4G VoLTE, Wi-Fi 802.11 ac and doubled performance in the performance of artificial intelligence tasks. For example, working with photos and images is 30% faster. The product has already entered mass production, and the first devices based on Helio P65 should be presented in July this year.
  14. The main features of Huawei P30 were shown on video; the first photos of Google Glass 2 were published; Samsung will expand the line of bendable smartphones; MediaTek is preparing to release a 7-nm chipset with 5G modem. The main features of Huawei P30 showed in the video Huawei has published on YouTube teaser preparing for the announcement of the smartphone P30. A short video confirmed the presence of the gadget zoom lens, which was previously reported, and other features of the future flagship. Judging by the animation on the 18-second mark, the device will be equipped with stereo speakers. It is possible and the emergence of new technology in the spirit of crystal Sound from LG, turning the display into a conductive membrane. Other three-dimensional effects do not indicate a specific function but may indicate support for the face detection option to unlock the device. Huawei P30 and P30 Pro will be presented on March 26 in Paris. Authoritative insider Roland Quandt claims that the older model will be presented in versions 8/128 GB, 8/256 GB and 8/512 GB, the price of gadgets at the start of sales is unknown. Published the first photos of Google Glass 2 Portal 9to5Google published pre-release photos of the second revision of augmented reality glasses from Google. The lens of insiders got an engineering version of the gadget. According to available information, the future novelty will receive a Snapdragon 710 processor, 3 GB of RAM, a built-in LTE modem, Wi-Fi 802.11 ac and Bluetooth 5.0 modules, a USB Type-C port, and a 32-megapixel camera capable of recording video in 4K resolution at a speed of 30 fps. The source of the leak is unknown — presumably to merge photos to the network could one of the staff of the regulator, the FCC, or even Google. The date of the announcement and the expected price of new items are not reported. It is likely that the search giant will introduce Google Glass 2 in the Google I/O conference in May 2019. Samsung will expand the line of bendable smartphones The production processes of Samsung reported the intention of the South Korean company to release a new model of the bendable smartphone following the announced at MWC 2019 Galaxy Fold. Sources claim the new Samsung gadget will be thinner than the already presented model because it will not be equipped with an external display. Also, the device is credited with a built-in fingerprint scanner and a more resistant to the number of bending cycles coating. The date of the device's appearance on the market and the expected price tag are unknown. MediaTek is preparing to release a 7-nm chipset with 5G modem Finbarr Moynihan, MediaTek's Vice President of corporate sales, said The company is working on a 7nm chipset that will support 5g connectivity and will take a flagship position in the brand's product line. He added that the new product will surpass the performance of Helio P90, built on a 12-nm process. Tandem processor on the cores ARM Cortex-A76 will be presented earlier modem M70 5G. The first smartphones based on the unannounced platform are expected in the second half of 2020. Presumably, the solution from MediaTek will be cheaper than analogs of Qualcomm, but the exact price of the future 7-nm chipset is not reported.

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