Only a few days have passed since the presentation of The Xiaomi Mi9 smartphone, but enthusiasts have already managed to look under the cover of the flagship gadget. The" discoverer " of the device was the user Weibo under the pseudonym Thomas, who published a detailed photo shoot with the participation of all key components of the new item.
Under the back cover of the device, protected by impact-resistant glass Gorilla Glass 5, is a massive coil of wireless charging capacity of 20 W, above is the antenna of the NFC module. Dismantling of these elements and the battery on 3300 mAh opens access to the motherboard on which the Snapdragon 855 chipset, 8 GB of RAM and 128 GB of built-in memory are soldered.
To effectively remove heat from the iron filling, the key components of the Board are covered with metal plates with thermal paste applied to them. This approach increases the efficiency of the cooling system, preventing a decrease in the processor clock speed when overheating.
The main camera module consists of a 48-megapixel Sony IMX586 main sensor (center), a telephoto lens with dual optical zoom, and a 3D ToF sensor. The whole structure is removed by simply disconnecting the loop from the system connector. At the bottom of the case, there is a fingerprint scanner and a module with a USB Type-C port, speaker and auxiliary elements.
In comments to the published images, the author noted that these photos should not be considered as instructions for repairing the gadget since the process of disassembly was left behind the scenes.
Sales of Xiaomi Mi9 with built-in display fingerprint scanner will start in China on February 26 at a price of $446.