The main features of Huawei P30 were shown on video; the first photos of Google Glass 2 were published; Samsung will expand the line of bendable smartphones; MediaTek is preparing to release a 7-nm chipset with 5G modem.
The main features of Huawei P30 showed in the video
Huawei has published on YouTube teaser preparing for the announcement of the smartphone P30. A short video confirmed the presence of the gadget zoom lens, which was previously reported, and other features of the future flagship.
Judging by the animation on the 18-second mark, the device will be equipped with stereo speakers. It is possible and the emergence of new technology in the spirit of crystal Sound from LG, turning the display into a conductive membrane. Other three-dimensional effects do not indicate a specific function but may indicate support for the face detection option to unlock the device.
Huawei P30 and P30 Pro will be presented on March 26 in Paris. Authoritative insider Roland Quandt claims that the older model will be presented in versions 8/128 GB, 8/256 GB and 8/512 GB, the price of gadgets at the start of sales is unknown.
Published the first photos of Google Glass 2
Portal 9to5Google published pre-release photos of the second revision of augmented reality glasses from Google. The lens of insiders got an engineering version of the gadget. According to available information, the future novelty will receive a Snapdragon 710 processor, 3 GB of RAM, a built-in LTE modem, Wi-Fi 802.11 ac and Bluetooth 5.0 modules, a USB Type-C port, and a 32-megapixel camera capable of recording video in 4K resolution at a speed of 30 fps.
The source of the leak is unknown — presumably to merge photos to the network could one of the staff of the regulator, the FCC, or even Google. The date of the announcement and the expected price of new items are not reported. It is likely that the search giant will introduce Google Glass 2 in the Google I/O conference in May 2019.
Samsung will expand the line of bendable smartphones
The production processes of Samsung reported the intention of the South Korean company to release a new model of the bendable smartphone following the announced at MWC 2019 Galaxy Fold.
"Nobody knows what perfect design is. It is time for experiments. Many of these projects will not be successful, but all industry players will receive valuable lessons along the way," said Bryan MA, Vice President of device research at IDC.
Sources claim the new Samsung gadget will be thinner than the already presented model because it will not be equipped with an external display. Also, the device is credited with a built-in fingerprint scanner and a more resistant to the number of bending cycles coating. The date of the device's appearance on the market and the expected price tag are unknown.
MediaTek is preparing to release a 7-nm chipset with 5G modem
Finbarr Moynihan, MediaTek's Vice President of corporate sales, said The company is working on a 7nm chipset that will support 5g connectivity and will take a flagship position in the brand's product line. He added that the new product will surpass the performance of Helio P90, built on a 12-nm process.
Tandem processor on the cores ARM Cortex-A76 will be presented earlier modem M70 5G. The first smartphones based on the unannounced platform are expected in the second half of 2020. Presumably, the solution from MediaTek will be cheaper than analogs of Qualcomm, but the exact price of the future 7-nm chipset is not reported.