TSMC has announced the start of commercial shipments of N7+ chips. The company said it was the first to release finished products manufactured using EUV lithography. Optimization of chip maker production is expected to avoid a shortage in the electronics market.
The N7+ process technology was developed on the basis of the current N7 using lithography in deep ultraviolet (EUV). New microcircuits, the serial production of which the chip maker began in May of this year, provide an increase in transistor density up to 20% compared to its predecessors with lower power consumption. According to the vendor, tools for the production of new-generation microcircuits for the first time in a long time have reached the required level of availability and performance.
HUAWEI and AMD have already announced the use of TSMC chips. The company has not yet specified which products will use the new chips. EUV technology allows TSMC to continue to scale chips. The start of the risky production of 6-nm products is expected at the beginning of next year, and mass deliveries of chips with the N6 manufacturing process at the end of 2020.